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BY558 |
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| Part Number | BY558 |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM384 Fig... |
| Features |
• Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Also available with preformed leads for easy insertion • Designed to withstand transients up to 1700 V. APPLICATIONS • For use in multi-sync monitor horizontal deflection circuits handbook, halfpage BY558; BY578 DESCRIPTION Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM384 Fig.1 Simplified outline (SOD115) and symbol. LIMITING VALUES In accordance... |
| Document |
 BY558 Data Sheet
PDF 66.23KB |
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